![]() The article is also not intended to provide detailed analysis on the proper design of heat pipes and heat sinks, but rather to offer guidance on the number and size of heat pipes used as well as to provide guidance for estimating heat sink size and determining attachment methods of the heat sink to the Printed Circuit Board (PCB). copper tube with sintered copper wick using water as the working fluid. ![]() In addition, discussion is focused on the most ubiquitous type of heat pipe, i.e. Discussion is constrained to those conditions as guidelines provided may not necessarily apply for power electronics applications. This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power dissipation ranging from 15 W to 150 W using processor die sizes between 10 mm and 30 mm square.
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